By Philip Garrou, Christopher Bower, Peter Ramm
The 1st encompassing treatise of this new and extremely vital box places the recognized actual boundaries for traditional second microelectronics
into standpoint with the necessities for additional microelectronics advancements and industry must haves. This two-volume handbook
offers 3D options to the characteristic density challenge, addressing all very important matters, comparable to wafer processing, die bonding, packaging
expertise, and thermal points. It starts off with an introductory half, which defines useful objectives, present matters and relates 3D integration
to the semiconductor roadmap of the undefined. prior to occurring to hide processing expertise and 3D constitution fabrication thoughts in
element. this is often through fields of program and a glance on the way forward for 3D integration.
The editors have assembled contributions from key educational and commercial avid gamers within the box, together with Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and so on.
Read or Download Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits PDF
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