This can be the 1st of 2 books featuring the demanding situations and destiny clients of plasma etching approaches for microelectronics, reviewing the prior, current and destiny problems with etching procedures on the way to increase the knowledge of those concerns via cutting edge solutions.

This publication specializes in again finish of line (BEOL) for prime functionality equipment attention and provides an summary of all etch demanding situations for interconnect cognizance in addition to the present etch ideas proposed within the semiconductor undefined. the alternative of copper/low-k interconnect structure is likely one of the keys for built-in circuit functionality, technique manufacturability and scalability.

Today, implementation of porous low-k fabric is necessary so as to reduce sign propagation hold up in interconnections. during this context, the conventional plasma procedure concerns (plasma-induced harm, size and profile keep an eye on, selectivity) and new rising demanding situations (residue formation, dielectric wiggling) are severe issues of analysis in an effort to keep an eye on the reliability and decrease defects in interconnects. those matters and power options are illustrated by way of the authors via assorted strategy architectures to be had within the semiconductor (metallic or natural not easy masks strategies).

  • Presents the problems encountered for interconnect attention in very large-scale built-in (VLSI) circuits
  • Focused on plasma-dielectric floor interaction
  • Helps you extra lessen the dielectric consistent for the long run technological nodes

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