By Takeshi Hattori (auth.), Dr. Takeshi Hattori (eds.)

The infection of wafer surfaces with debris coming up from the processing apparatus is the most reason behind yield losses within the production of VLSI units. the place to begin for the regulate of infection needs to be the outside of the wafer itself and never simply the relief of infection within the ambient air or within the gases, chemical substances and water used for construction. a unconditionally new notion for fresh floor processing is brought the following. a few fifty special researchers and engineers from the prime eastern semiconductor businesses, reminiscent of NEC, Hitachi, Toshiba, Sony and Panasonic, in addition to from a number of universities divulge to us for the 1st time the secrets and techniques of those hugely effective associations. They describe the thoughts and kit precious for the training of fresh top of the range semiconductor surfaces as a primary step in high-yield/high-quality machine creation. This publication therefore opens the door to the producing of trustworthy nanoscale units and should be tremendous necessary for each engineer, physicist and technician interested by the construction of silicon semiconductor devices.

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